Product

Equipment Contamination Control Tool

Exhaust Pressure Control (EPC)

Advanced Solution for the Semiconductor Industry

Exhaust Pressure Control (EPC) manages the chamber pressure without throttle valve. It provides uniformity flow in the chamber and avoids undesired particle contaminations. It is designed to provide Advanced Solutions in today’s and tomorrow's clean room technology.

Using a new Technology:
Alcatel Vacuum Technology took the benefit variable speed CPM systems to design an etching-tool pressure regulation system able to meet the needs of most etching tools and current applications. By controlling the exhaust pressure, the EPC controls the turbo pumping speed, and finally the chamber pressure.

High performance System:
• Thanks to its fast actuators (valve), the response time can be down to 3s, depending on processes and configuration. The static error (stability) never exceeds ± 2% of the set point.
• A learning mode records the piping configuration influence, which increases the efficiency during regulation phases.

Defectivity & MTBC improvements:
• The EPC target is to reduce defectivity on etching tools (aluminum, poly-etch, and oxide etch process).
• Another target is to increase tools MTBC by suppressing any regulating valve move. This way, no particle or by-product can get off the valve to contaminate the wafer or the chamber.


For more information, please contact Roland BERNARD: roland.bernard@adixen.fr

Exhaust Pressure Control (EPC)

Documentation :

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