"The front-opening unified pod (FOUP) is a 300mm wafer handling and contamination control device, used in the semiconductor manufacturing industry. ..."

See the file attached to read more about this article.
R. Bernard, A. Favre, H. Kambara, “Preventing wafer contamination” Fluent news letter spring 2004 issue, p22 (2004)

For more information please contact :
Hisanori KAMBARA, (Business development), contact for Asia except Singapore
hisanori.kambara@adixen.fr